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WELCOME
MICROSCAN is a collaboration between EU companies and research organisations with a view to producing a powerful tool in the total
quality control of PCB assemblies. All current PCB inspection systems have a major drawback in that none (except perhaps AOI) can be
installed in-line and consequently can only be used to conduct batch tests with limited defect detection capability. AOI currently is
also limited to line-of-sight inspection and cannot be applied to hidden joints and devices/features (e.g. ball grid array packages,
integrated passives and vias in multi-layer boards), which are increasingly being used on high density boards. It also needs to
be developed for the new lead-free alloys with their 'dull' surface finish and new joint profiles.
This project will overcome these problems by delivering 4 non-destructive Testing (NDT) inspection prototypes that can be fully integrated with a PCB production line with the aim of providing full quality control of the PCB assembly process. Members
MICROSCAN is a collaboration between the following organisations: TWI Ltd, X-TEK Systems Ltd, Lot Oriel GmbH, Machine Vision Products Inc, Microtel
technologie elettroniche s.p.a., Beta Electronics Ltd, Ultrasonic Sciences Ltd, Goodrich Control Systems Ltd,
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V. and Kaunas University of Technology. The project is co-ordinated and managed by
TWI Ltd and is partly funded by the EC under the CRAFT programme ref: COOP-CT-2003-508613.
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