In 1985 Microtel started the SMT department, enabling to offer a complementary and complete approach to the Design, Manufacture & Test of electronic Modules, Boards and Equipment. Microtel offers the following services:
- Electronic Design
- CAD lay-outing of Thick Film and PCB Boards
- Material procurement
- Assembling
- Testing and Burn-in
- Quality Control & Classified Document management
- Automatic high speed SMT Assembling with optical centering
- Automatic Through-Hole taped components Assembling
- Thick Film Hybrids on ceramic substrates
- Ceramic pressure sensor production
- Chip On Board bonding
- Insulated Metal Surface (IMS) Power Modules
- BGA, µBGA, Flip-Chip
- LTCC multilayer ceramic Module
- Nitrogen Reflow & Nitrogen atmosphere Wave soldering (both Tin/Lead and Lead Free); automatic robot soldering
- X-ray and AOI inspections
- In-Circuit and Functional Electrical Test on ATE
- Leak Test; Thermal Shock, Burn-in
- Ionic contamination measurements
- Automated conformal coating dispenser
It is certified UNI EN ISO 9001:2000; qualified according NATO AQAP120 for bonding on microwave structures; qualified by CNES for micro-assembling of satellite encoders; it is registered as SNCF qualified supplier.
Role in project and reason for participation As a leading manufacturer and service provider, Microtel is committed to providing the investment required in automation, quality and professional expertise to maintain its position in the marketplace. The company will benefit from the expertise gained in this project, in its production of surface mount products, and it will be able to better utilise its fully automated line and placement machines and as a result offer its customers a more flexible solution.
