Each NDT technique at present is optimised for a specific type of PCB assembly and is also best suited to specific types of production flaws, hence a matrix of flaws aligned with the most suitable detection techniques has been produced. A number of different PCB assemblies incorporating these flaws will be manufactured to test and trial the prototypes.

The table below shows the agreed list of defects and the system technology assigned for inspection. The fourth column of the table shows the significance of each of the agreed defects.

No.	Description	Selected Inspection Technology(s)	Priority	Defect Class
1	Dry joints	AOI / THERM?	high	Soldering
2	Lead less CC solder short	AOI / X-Ray	high	Soldering
3	Lead less CC poor wetting	AOI / X-Ray/ THERM	high	Soldering
4	BGA voiding	X-Ray	high	Soldering
5	BGA bridging	X-Ray	high	Soldering
6	BGA tilted	X-Ray	high	Soldering
7	BGA missing balls	X-Ray	high	Soldering
8	BGA poor wetting	X-Ray	high	Soldering
9	BGA poor reflow	X-Ray	high	Soldering
10	Leaded CC poor heel joint	X-Ray / THERM	high	Soldering
11	Flip chip joints	X-Ray / THERM	high	Soldering
12	Flip chip underfill	X-Ray / THERM / SAM	high	Soldering
13	Leaded CC lifted leads	AOI / THERM	high	Soldering
14	SOT SOIC lead lift	AOI / THERM / X-Ray	high	Soldering
15	solder balls	AOI	high	Soldering
16	PTH solder poor fill	AOI / X-Ray	Medium	Soldering
17	PTH poor lead wetting	AOI / X-Ray	Medium	Soldering
18	heat plane delamination	SAM/THERM	Medium	Board
19	Plastic Encapsulated Delamination	SAM	Medium	Components
20	chip capacitor crack	SAM/X-Ray	Medium	Components
21	Missing component	AOI/X-ray	Medium	Components
22	Tombstone component	AOI/X-ray	Medium	Components
23	Mis-oriented components	AOI	Medium	Components
24	Tilted component	AOI	Medium	Components