PROJECT
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X-ray Technique
Optical Technique
Thermal Technique
Typical PCB Defects detected with X-ray
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| X-ray image shows a dry BGA | Misplaced BGA | Shorted BGA |
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| Voiding and ball cracking in BGA | Trapped component causing lift | Tilted BGA |
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| Board delamination | Cracked cap | Die attach voids |
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| Flip chip | Blown wirebond | Cracked diode |
Typical PCB Defects detected with AOI
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| Good positioned Ceramic Capacitor (included for reference) | Tilted Ceramic Capacitor | Missing Ceramic Capacitor |
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| Lifted lead on Dual In Line (DIL) Integrated Circuit (IC) | Unsoldered lead on Thin Quad Flat Pack (TQFP) IC | |
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| Good positioned resistor but flipped | Tomb stoned resistor - open solder at one end | Solder Bridge/short on DIL IC |
Typical PCB Defects detected with Thermography
| Active Thermography | |
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| Delamination of layers within PCB | Possible delamination within chip package |
| "Passive" Thermography | |
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| Infrared signature for IC | Two resistors shorted causing IC to overheat |
Typical PCB Defects detect with Scanning Acoustic Microscopy
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| The C scan image of a set of capacitors with a cracked one | The C scan image of a chip with detected delamination |
PARTNERS
MICROSCAN is a collaboration between the following organisations: TWI Ltd, X-TEK Systems Ltd, Lot Oriel GmbH, Machine Vision Products Inc, Microtel
technologie elettroniche s.p.a., Beta Electronics Ltd, Ultrasonic Sciences Ltd, Goodrich Control Systems Ltd,
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V. and Kaunas University of Technology. The project is co-ordinated and managed by
TWI Ltd and is partly funded by the EC under the CRAFT programme ref: COOP-CT-2003-508613.
