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A combination of four modular inspection systems each employing a different non destructive testing technique for PCB inspection is to be developed. The non destructive testing techniques are based on digital radiography, thermal inspection, automated optical imaging and acoustic microscopy. The techniques shall be developed and their particular advantages in relation to PCB inspection shall be utilised to complement each other with the goal of a combined 100% defect detection coverage. Depending on any given PCB configuration that is to be inspected, the inspection modules shall be designed so that they can be used separately, together or interchanged to give the best results in terms of inspection coverage and inspection throughput.